Inspection of Electronic Assemblies: Introduction

Download the syllabus.

MODULE 1: INDUSTRY STANDARDS, PRODUCT CLASSES, AND ACCEPTABILITY

• Identify the most common IPC standards used by electronics assembly inspectors
• Use the product class and condition criteria in IPC standards to determine the acceptability of the parts and components on a PCB assembly 
• Use the table of contents, index, and appendices to quickly navigate IPC standards
• Explain how metric and imperial units of measurement are used in IPC standards
• Explain how more than, less than, and equal to symbols are used in IPC standards
• Use figures, illustrations, and tables to determine the acceptability of the parts and components on a PCB assembly 
• Demonstrate effective strategies for interpreting  acceptability criteria, including figures and illustrations, tables, and units of measurement
• Explain common industry-specific terms employed by inspectors

MODULE 2: INSPECTION METHODS, AIDS, TOOLS & TECHNIQUES

• Explain Standard Inspection Protocol (SIP) and order of precedence
• Differentiate between visual, X-ray, and Automated Optical inspection methods 
• Use work instructions and IPC standards to select the correct magnification power for visual inspection 
• Perform visual inspection with common magnification tools such as loupes and microscopes
• Use rulers, calipers, micrometers, go-no-go gauges and pull testers to perform visual inspection 
• Verify the calibration labels of measurement tools
• Demonstrate recommended techniques to visually identify and document potential defects

MODULE 3: DOCUMENTATION

• Identify the different parts of an assembly drawing
• Use an assembly drawing to verify that the visible features of an assembly meet customer specifications
• Explain the role of GD&T symbols in assembly drawings
• Explain the function and contents of work instructions and Bill of Materials (BOM)
• Use work instructions to inspect an assembly according to customer specifications
• Use a Bill of Materials to confirm the presence of specific parts materials listed in an assembly drawing
• Explain the purpose of referenced specifications

MODULE 4: COMPONENT CHARACTERISTICS

• Identify and distinguish the characteristics of through-hole and surface-mount components
• Recall the processes used to mount through-hole and surface-mount components 
• Identify and distinguish component packages and component packaging
• Identify the most common types of components used in electronics assembly
• Describe the purpose of common electronic components 
• Use documentation, component reference designators, sample boards, and markings on components and PCAs to verify that the right components have been correctly placed and oriented on an assembly

MODULE 5: RECEIVING AND INCOMING INSPECTION

• Explain the importance of a well-developed incoming inspection plan
• Identify the various steps of a typical incoming inspection process 
• Inspect materials, parts, and packaging for signs of damage
• Use documentation to verify that incoming parts and materials conform to customer specifications 
• Use documentation to determine proper storage for materials
• Use documentation to verify that PCB dimensions, markings, and soldermask conform to quality requirements and customer specifications 
• Identify common measurement and testing methods used for incoming materials and printed boards

FINAL EXAM
Participants must complete the Final Exam with a passing score of 80% to access and download their Inspection of Electronic Assemblies: Introduction course certificate of completion. Students may attempt the exam up to three (3) times. Please note that a third and final attempt is permitted after 24 hours of the second attempt.