Learning Objectives

Download the syllabus.

Module 1: Introduction

• Define the purpose of the IPC-HDBK-610 and IPC-A-610
• Use cross-reference tables in the IPC-HDBK-610 to locate content in IPC-A-610
• Interpret product classes and acceptability designators
• Apply inspection criteria and methodologies

Module 2:  Electrostatic Discharge

• Formulate and use an ESD control plan to prevent ESD in facility
• Describe the elements of an ESD control plan
• Distinguish between methods of ESD prevention
• Describe an ESD-safe workstation
• Develop safe handling procedures

Module 3: Mechanical Assembly

• Identify the criteria used to evaluate mechanical assembly
• Define minimum electrical clearance
• Identify the cause of interference in fitting mechanical hardware
• Explain the requirements for mounting high power components
• Define the requirements for mounting heatsinks
• Detail the characteristics of threaded hardware
• Define torque and its impact on assembly
• Identify connector pins and their role in assembly

Module 4: Soldering

• Describe the general acceptability criteria of solder joints
• Identify poor solder joints with poor wetting or solderability
• Differentiate between soldering anomalies
• Determine the cause of soldering anomalies

Module 5: Through-Hole Technology

• Differentiate through-hole component mounting and terminational requirements
• Identify lead protrusion and clinching inspection criteria
• Distinguish minimum acceptable solder conditions for PTH leads

Module 6: Surface Mount Assemblies

• Determine the criteria for staking adhesive
• Apply methods to ensure quality staking
• Define the requirements for proper lead formation
• Identify the tools you should provide your operatives to form leads
• Differentiate between types of SMT connections
• Implement methods for controlling SMT connection features
• Discuss the criteria for SMT connectors

Module 7:  Component Damage

• Recognize common types of component damage and the associated consequences
• Classify acceptability criteria for common types of component damage
• Distinguish related causes of and solutions for each type of component damage

Module 8: Printed Boards and Assemblies

• Differentiate between common conditions for PCBs and assemblies
• Determine the acceptability of common conditions for PCBs and assemblies
• Identify the common causes of PCB and assembly conditions
• Implement steps to resolve common causes of PCB and assembly conditions

Module 9: High Voltage

• Explain the importance of preventing corona discharge in high-voltage applications
• Identify the IPC-A-610 high-voltage criteria
• Identify steps & methods to minimize common high-voltage defects

Module 10: Jumper Wires

• Determine acceptable jumper wire routing
• Implement an acceptable staking process
• Differentiate between acceptable methods of connecting wires

FINAL EXAM

Participants must complete the Final Exam with a passing score of 80% to access and download their Ensuring Excellence: IPC-A-610 Process Optimization Certificate of Completion. Students may attempt the exam up to three (3) times. Please note that a third and final attempt is permitted after 24 hours of the second attempt.