Manufacturing Engineering for Electronics Assembly: Stencil Printing

The Manufacturing Engineering for Electronics Assembly: Stencil Printing course provides a comprehensive overview of the stencil printing process, .the process of depositing solder paste on the printed wiring boards (PWBs) to establish electrical connections Participants will learn how to select and store solder pastes & adhesives. They will also learn how to create and maintain stencils, the function of the stencil printer, as well as how to set up the stencil printer for a new product introduction, or NPI, run. Participants can take this content-specific course to learn more about the role of manufacturing engineers regardless of company size and industry sector.  A certificate of completion is awarded upon successful completion of each course. 

Member Price
$200.00
Non-member Price
$275.00
Access
90 Days From Enrollment

  • Course Level: Intermediate

  • Training Time

    4 modules/approx. 4hr 45min

  • Certificate of Completion

  • Continuous Enrollment

    Access for 90 Days

Questions

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Download the syllabus.

Module 1: Solder Paste & Adhesives

  • Understand how solder paste materials and composition affect your solder paste 
  • selection for a given design 
  • Establish procedures for handling and storage of solder paste based on 
  • manufacturer's requirements 
  • Establish procedures for handling and storage of glues and adhesives based on 
  • manufacturer's requirements

Module 2: Stencil Characteristics Creation & Maintenance

  • Select stencil characteristics and features based on your board design 
  • Convert PCB design file into a stencil image to meet your manufacturing requirements 
  • Establish procedures for the maintenance and storage of stencils 

Module 3: The Stencil Printing Process

  • Outline the steps for stencil printer setup
  • Create a stencil printer program with the correct parameters for your application 
  • Evaluate stencil printer parameters based on an initial test print 

Module 4:  NPI Printer and Line Set Up

  • Select a solder paste inspection (SPI) machine type based on your manufacturing requirements
  • Use criteria to identify common solder paste printing defects
  • Use best practices to prevent solder paste printing defects
  • Describe why and how stencils are cleaned
  • Determine and implement a stencil cleaning and storage process based on best practices

FINAL EXAM
Participants must complete the Final Exam with a passing score of 80% to access and download their Manufacturing Engineering for Electronics Assembly: Stencil Printing Certificate 

Engineers and technicians who want a thorough understanding of the PCB stencil printing process.

IPC offers different instructional modalities to suit participants with different needs and preferences. This program is available in the following modalities:

Online-self-paced: Participants can access course materials on the IPC EDGE Learning Management System at any time and complete them at their own pace. However, organizations may set completion deadlines, as well as monitor the progress of the participants they register for a course.

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