Soldering for Electronics Assembly: Introduction

This course is designed to provide learners with an understanding of the soldering process, the role it plays in electronics assembly, and the practical skills required in creating reliable solder connections. 

After successfully completing this course, participants will be able to: 

  • Identify common features and components of a printed circuit board assembly 
  • Identify the tools and equipment utilized for soldering
  • Practice soldering components onto a printed circuit board
  • Build a functional printed circuit board assembly
     
Member Price
80,00 $
Non-member Price
100,00 $
Access
90 Days From Enrollment

  • Course Level: Introductory

  • Training Time

    8-12 hours

  • Certificate of Completion

  • Continuous Enrollment

    Access for 90 Days

Questions

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Download the syllabus.

SECTION 1: INTRODUCTION TO PCBs

  • Describe the characteristics of rigid, flex and ceramic PCBs 
  • Describe the characteristics and function of traces, lands, through-holes, vias, markings, and solder mask 
  • Explain how soldering is used to connect components to a PCB

SECTION 2: INTRODUCTION TO SOLDERING

  • Describe the composition of the most common types of solder 
  • Describe the characteristics of eutectic solder 
  • Distinguish leaded from non-leaded solder
  • Identify the different forms of solder 
  • Select the correct solder wire diameter for a given connection  
  • Describe the types and function of flux 
  • Use flux to clean connections and solder iron tips
  • Describe the role of heat in the soldering process

SECTION 3: EQUIPMENT & TOOLS

  • Identify the parts of a solder station
  • Set the temperature on a solder station
  • Identify different types of solder tips
  • Select the correct size of solder tip
  • Use sponge and brass pad to clean a solder tip
  • Use solder sick to remove solder
  • Use cutters to trim component leads
  • Select the correct type of pliers to form component leads
  • Explain the function of brushes, tweezers, wooden sticks, and dental picks
  • Identify different types of magnification aides
  • Set up and use a microscope

SECTION 4: PREPARATION OF COMPONENTS

  • Explain the process of manually preparing a through-hole component
  • Use pliers to form the leads of a through-hole component 
  • Use cutters to trim the leads of a through-hole component

SECTION 5: MANUAL SOLDERING PROCESS

  • Tin a solder iron tip
  • List the steps of the manual soldering process
  • Solder through-hole components to a PCB

SECTION 6: SOLDERING JOINT EVALUATION

  • Describe wetting
  • Identify a properly wetted solder connection
  • Identify common solder connection defects

HANDS-ON EXERCISES

  • Identify the equipment, tools, and materials used to create basic solder connections 
  • List steps for applying solder to empty PCB lands and through-holes
  • Describe common errors in the soldering process for empty PCB lands and through-holes
  • Apply solder to empty PCB lands and through-holes
  • List steps for soldering through-hole components to a PCB
  • Describe common errors in the through-hole component soldering process
  • Solder through-hole components to a PCB
  • List steps for soldering chip components to a PCB
  • Describe common errors in the chip component soldering process
  • Solder chip components to a PCB
  • List steps for soldering gull wing components to a PCB
  • Describe common errors in the gull wing component soldering process
  • Solder gull wing components to a PCB
  • Explain two different methods for reworking nonconforming solder connections

FINAL EXAM
Participants must complete the Final Exam with a passing score of 80% to access and download their Soldering for Electronics Assembly: Introduction Certificate. Students may attempt the exam up to three (3) times. Please note that a third and final attempt is permitted after 24 hours of the second attempt.
 

This course is designed for engineers, technicians, operators, and other staff members that need instruction in soldering in an electronic manufacturing environment.

IPC offers different instructional modalities to suit participants with different needs and preferences. This program is available in the following modalities:

Online-self-paced: Participants can access course materials on the IPC EDGE Learning Management System at any time and complete them at their own pace. However, organizations may set completion deadlines, as well as monitor the progress of the participants they register for a course.

Learn how to create industry acceptable solder joints for through-hole and surface mount chip and gull wing components. This innovative multimedia course capitalizes on the power of the hear-see-do methodology to equip students with actionable techniques and best practices they can immediately apply on the job. Students will learn key concepts, tools, and techniques, then use the accompanying practice and project boards, available at the link below, to practice and demonstrate their new skills.

Purchase hands-on soldering board from STI