Workforce Training

A comprehensive overview of process control methodology including how to utilize the IPC-J-STD-001 Standard and its associated Handbook to consistently conform to acceptance criteria throughout the assembly process.

Help your team enhance product reliability, reduce rework and scrap, and ensure customer satisfaction. This comprehensive overview of process control methodology will empower technicians and engineers to utilize the IPC-A-610 Standard and its associated Handbook to consistently meet acceptance criteria throughout the assembly process.

Engineers make decisions every day that impact manufacturing. Make sure it's a positive impact by introducing the key concepts, tools, materials, and processes critical for engineers to succeed in electronics assembly.

Onboarding manufacturing engineers new to the electronics industry can be a daunting task. What if you had a self-paced course that provides a comprehensive overview of the roles and responsibilities of manufacturing engineers in our industry? IPC worked with industry subject-matter experts and instructional designers to create an introductory course that takes approximately 3-1/2 hours to complete. In addition to understanding the role, participants will also learn to use documentation control systems, product identification, and product traceability.

A comprehensive overview of the stencil printing process for a manufacturing engineer. Participants will learn how to select and store solder pastes & adhesives. They will also learn how to create and maintain stencils, the function of the stencil printer, as well as how to set up the stencil printer for a new product introduction, or NPI, run.

This course provides a comprehensive overview of the surface mount assembly process including information on component considerations, selecting and setting up pick and place machines, and the reflow process. Participants can take this content-specific course to learn more about the role of manufacturing engineers regardless of company size and industry sector.

This course provides a comprehensive overview of component preparation, tool selection, manual component insertion, and automated component insertion in electronics assembly with through-hole components. Participants can take this content-specific course to learn more about the role of manufacturing engineers regardless of company size and industry sector.  

Learn a specific set of knowledge and skills that every operator needs to build quality wires and cable harnesses all contained in as little as 16 hours of training.

This course provides a practical introduction to the terms, concepts, and acceptability requirements of the IPC J-STD-001 standard as they apply to the role of the operator.

This course provides a practical introduction to the terms, concepts, and acceptability criteria of the IPC-A-610 standard as they apply to the role of the operator.

This course provides a practical introduction to the terms, concepts, and acceptability criteria of the IPC/WHMA-A-620 standard as they apply to the role of the operator.

Dieser Kurs macht die Teilnehmer mit den Ursachen von Ablagerungen von Fremdpartikeln (FOD) und den Maßnahmen vertraut, die Sie ergreifen können, um die Auswirkungen von FOD bei der Handhabung, der Lagerung oder dem Transport von Gegenständen in einer Fertigungsstätte zu verringern.

This course is ideal for operators, technicians, supervisory personnel and other staff members that must consistently and effectively employ the key tools, materials, and processes designed to keep workers safe within a manufacturing facility.

This Inspection of Electronic Assemblies: Introduction course trains participants to perform "incoming inspection" using the essential tools, materials, and processes that deliver consistent quality products. Completion of this course delivers a professional level of proficiency in acceptability standards, inspection methods and tools, documentation, and component characteristics. 

This course introduces the key concepts, tools, materials, and processes that operators need to know to do their best work. Participants can complete the core set of modules to receive their certificate of qualification, then select among nine voluntary modules for process-specific training.

Learn how to create industry acceptable solder joints for through-hole and surface mount chip and gull wing components. This innovative multimedia course capitalizes on the power of the hear-see-do methodology to equip students with actionable techniques and best practices they can immediately apply on the job. Students will learn key concepts, tools, and techniques, then use the accompanying practice and project boards, available here, to practice and demonstrate their new skills.

This series of ten micro-modules introduce some of the key concepts required to optimize the design of printed circuit boards for manufacture. If you'd like to learn more after completing the series, consider consider taking the IPC Design for Manufacturability course.

In the competitive printed circuit board fabrication industry, high reliability and high yields are crucial for profitability. That's why process and manufacturing engineers involved in fabrication, assembly, and procurement need to have the necessary knowledge and skills to produce and evaluate top-quality printed circuit boards. This includes understanding materials, chemical processes, equipment parameters, and their impact on board quality. After completing this course, you will be able to: Identify and correct control processes that negatively affect circuit board quality Establish the root cause of potential defects to minimize and prevent loss of quality Recognize the interrelationships of PCB materials, processes, and equipment and how these relationships affect PCB and PCA quality Identify the root cause and corrective action for PCB defects, such as interconnect separation, delamination, wedge voids, plating folds, microvoids, surface pitting, and hole wall pull-away Identify the root cause and corrective action for electrodeposition defects, such as mouse bites, pitting, and domed or crown plating Identify the root cause and corrective action for solderability and assembly-related issues, such as outgassing, black pad, creep corrosion, and blow holes

This two to four-hour course facilitates mastery of the key concepts required for successful printed circuit board troubleshooting and defect analysis.