Training for Engineers

Specialist engineers are critical to electronics manufacturing. Production and process engineers, manufacturing engineers, design engineers and quality engineers are all part of the electronics manufacturing ecosystem. IPC relies on industry engineers to develop IPC standards and our training courses. The results are standards and training courses created explicitly for the electronics manufacturing community. Choose from courses focused on electronics assembly, PCB design, process engineering and program management.

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Developed for Engineers New to Electronics Manufacturing

Learn the Fundamentals of Electronics Assembly

Electronics Assembly for Engineers
Engineers make decisions every day that impact manufacturing. Make sure it's a positive impact by introducing the key concepts, tools, materials, and processes critical for engineers to succeed in electronics assembly.
Certified Electronics Program Manager (CEPM) Program
Taught by an IPC-certified industry expert with more than 30 years of experience in the field, this 6-week online program covers the key business and technical concepts that program managers in the electronics industry need to turn customers into lifelong clients.

PCB Fabrication and Program Management

Electronics Manufacturing floor
In the competitive printed circuit board fabrication industry, high reliability and high yields are crucial for profitability. That's why process and manufacturing engineers involved in fabrication, assembly, and procurement need to have the necessary knowledge and skills to produce and evaluate top-quality printed circuit boards. This includes understanding materials, chemical processes, equipment parameters, and their impact on board quality. After completing this course, you will be able to: Identify and correct control processes that negatively affect circuit board quality Establish the root cause of potential defects to minimize and prevent loss of quality Recognize the interrelationships of PCB materials, processes, and equipment and how these relationships affect PCB and PCA quality Identify the root cause and corrective action for PCB defects, such as interconnect separation, delamination, wedge voids, plating folds, microvoids, surface pitting, and hole wall pull-away Identify the root cause and corrective action for electrodeposition defects, such as mouse bites, pitting, and domed or crown plating Identify the root cause and corrective action for solderability and assembly-related issues, such as outgassing, black pad, creep corrosion, and blow holes
Certified Electronics Program Manager (CEPM) Program
Taught by an IPC-certified industry expert with more than 30 years of experience in the field, this 6-week online program covers the key business and technical concepts that program managers in the electronics industry need to turn customers into lifelong clients.