PCB Fabrication for Operators

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Module 1: PCB Fabrication Overview

• Identify the three main types of PCBs: rigid, flex, and rigid flex
• Explain IPC product classes
• Describe PCB characteristics and how their design supports functionality and reliability
• Understand the purpose of front-end engineering
• Identify the purpose of each step in the PCB fabrication process 

Module 2: Inner-Layer Fabrication 

• Explain the sequence of the inner-layer fabrication process
• Recognize the importance of each step in the inner-layer fabrication process
• Explain the steps of the photoresist application and imaging processes
• Use the traveler to perform each step in the inner-layer process
• Explain the purpose and sequence of the develop, etch, and strip (DES) process
• Explain the post-etch punch process
• Describe the automated optical inspection (AOI) process
• Identify potential complications and corrective actions for the inner layer fabrication process 

Module 3: Preparation for Lamination 

• Identify the key materials and tools required for the lay-up process
• Describe the handling and storage requirements for pre-preg
• Use the traveler to complete the pre-preg kitting and lay-up processes
• Explain the chemical bond enhancement and pre-preg cooler processes 

Module 4: Lamination

• Sequence the stages of the lamination process, including pressing, breakdown, and routing
• Identify and select the correct lamination recipe and panel settings
• Describe the depinning and breakdown steps
• Use the traveler to complete the routing and scribe processes

Module 5: Via Fill & Planarization

• Sequence the steps of the via fill and planarization process
• Identify the purpose and benefits of via filling
• Explain the roles of the fill and scavenger machines
• List key steps in the planarization process 

Module 6: Optimization and Drilling

• Explain the optimization process
• Implement the steps to assemble a drill bit cassette
• Identify the procedures for setting up and operating mechanical and laser drill machines
• Sequence the steps of the optimization, drill kitting, drilling, deburring, and hole-checking processes
• Use the traveler to complete the optimization process
• Implement hole-checking procedures

Module 7: Outer-Layer Fabrication 

• Explain the importance of each step used to prepare the panel for plating
• Differentiate between electroless and electrolytic copper processes
• Explain the SES (strip-etch-strip) process
• Use the traveler to complete the desmear, electroless copper application, laser direct imaging, electrolytic copper application, and automated optical inspection      processes

Module 8: Solder Mask and Marking

• Distinguish between solder mask and marking
• Identify misregistration of solder mask and marking
• Distinguish between marking application methods
• Identify various marking application methods, their processes, and inspection criteria.
• Explain how marking techniques ensure accurate, durable, and compliant markings on printed circuit boards

Module 9: Surface Finishes 

• Describe the purpose of surface finishes
• Distinguish between surface finish methods
• Identify the steps involved in applying and verifying hot air solder leveling (HASL), immersion silver, and electroless nickel immersion gold (ENIG) surface finishes
• Sequence the steps for the HASL, immersion silver, ENIG, and XRF processes
• Explain how X-ray fluorescence (XRF) technology is used to measure surface finish thickness
• Outline the process steps for final routing
• Describe the purpose and steps of the final scrubbing process

Module 10: Electrical Test, Inspection, and Packaging

• Use the board schematic to complete the high potential (hipot) electrical test
• Differentiate between high potential and flying probe tests
• Describe how to operate a flying probe machine
• Identify the tests conducted during the final inspection process
• Retrieve shipping information and prepare PCBs for packaging based on surface finish requirements