Preguntas
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Module 1: Introduction
• Distinguish between through-hole (TH) and surface mount (SMT) components
• Explain the materials, tools, and processes used to assemble TH, SMT, and mixed technology PCAs
• Distinguish between component packages and component packaging
• Distinguish between through-hole (TH) and surface mount (SMT) components
• Explain the materials, tools, and processes used to assemble TH, SMT, and mixed technology PCAs
• Distinguish between component packages and component packaging
Module 2: Component Verification
• Describe how markings are used to identify the origin and value of a component
• Use a manufacturer data sheet to determine the characteristics of a component
• Use component reference designators to identify the most common types of components
• Describe the purpose and contents of a bill of materials
• Recognize the polarity markings of common types of components
• Recognize the markings used to correctly orient components on a PCB
• Use component markings, PCA markings, assembly drawings, and sample boards to verify that the right components have been correctly placed and oriented on the assembly.
Module 3: Resistors
• Explain the function of a resistor
• Visually identify the most common types of TH and SMT resistors
• Explain ohm, tolerance, and PPM (parts per million per degree °C)
• Interpret component markings and code tables to determine a resistor’s value, tolerance, and PPM
• Use component markings, BOM, packaging, and data sheet to verify that the correct resistor is installed in the correct location on a PCB
• Examine the characteristics of resistor array and power resistors
• Determine a resistor’s power rating
Module 4: Capacitors
• Explain the function of a capacitor
• Visually identify the most common types of TH and SMT capacitors
• Explain capacitance and voltage
• Use a capacitance conversion table (microfarad, nanofarad, picofarad)
• Interpret component markings to determine capacitance, voltage, and tolerance
• Use markings, BOMs, packaging, and data sheet to verify that the correct capacitor is installed in the correct location on a PCB
• Use polarity markings to verify correct orientation on a PCB
Module 5: Inductors
• Explain the function of an inductor
• Explain inductance
• Visually identify the most common types of TH and SMT inductors
• Use an inductance conversion table (millihenries, microhenries, nanohenries)
• Interpret inductor color bands and alphanumeric codes to determine inductance and tolerance
• Use component markings, BOM, packaging, and data sheet to verify that the correct inductor is installed in the correct location on a PCB
Module 6: Diodes
• Explain the function of the most common types of diodes
• Explain voltage (volts) and current (amperes) and how they determine the operation of diodes
• Identify the types of component packages used to house the most common types of TH and SMT diodes
• Use component markings, BOM, packaging, and data sheet to verify that the correct diode is installed in the correct location on a PCB
• Use polarity markings to verify correct orientation on a PCB
Module 7: Transistors
• Explain the characteristics and function of the two most common types of transistors (BJTs and FETs)
• Identify the types of component packages used to house the most common varieties of TH and SMT diodes
• Use assembly documentation and manufacturer data sheets to verify the identity value, and characteristics of a transistor
• Use assembly documentation, data sheets, and component and board markings to identify pin 1 and ensure that transistors are correctly oriented on the PCB
Module 8: Integrated Circuits
• Explain the characteristics and function of the most common types of transistors
• Identify the types of component packages used to house common varieties of TH and SMT diodes
• Use assembly documentation and manufacturer data sheets to verify the identity value, and characteristics of an integrated circuit
• Use assembly documentation, data sheets, and component and board markings to identify pin 1 and ensure that integrated circuits are correctly oriented on the
PCB
This course is ideal for operators who need to handle and place components accurately during the assembly process, technicians responsible for troubleshooting and repairing electronic assemblies, and engineers involved in the design, testing, and quality assurance of electronic products.
IPC offers different instructional modalities to suit participants with different needs and preferences. This program is available in the following modalities:
Online-self-paced: Participants can access course materials on the IPC EDGE Learning Management System at any time and complete them at their own pace. However, organizations may set completion deadlines, as well as monitor the progress of the participants they register for a course.