Top Lead-Free Production Defects and Issues, Causes, Remedies and Prevention

Seeking high production yields and reliable products requires preventing Pb-free production problems. Solutions require a diagnosis and an understanding of the likely causes of each production issue and the corresponding remedy. Designers, quality, manufacturing, reliability, researchers, managers, and decision-makers can benefit from acquiring a broad-based understanding of the challenges Pb-free production presents. The course balances between real-world hands-on practice and the engineering fundamentals behind sound practice. Participants are encouraged to bring their production floor issues for discussion.

Precio para miembros
$600.00
Nonmember Price
$800.00
Acceso
90 Días a partir de la Inscripción

  • Nivel del Curso: Intermediate

  • Tiempo del Curso

    2 weeks (8 hours, 4 sessions)

  • Certificado Obtenido

  • Seasonal Enrollment

    Acceso durante 90 Días

Preguntas

¿Necesita saber más? Envíanos tus preguntas y te daremos una respuesta.

Download the syllabus.

The week one sessions focus on the causes, remedies, and preventative measures for production defects associated with solder joint and assembly.
Topics include:

  • Premise
  • Solder joint surface crack 
  • Fillet-Lifting
  • Solderability & wetting related issue
  • Solder balling / graping
  • Solder beading
  • Cold solder joint
  • Starved joint or open solder joint
  • Wicking
  • Head-on-pillow
  • Copper dissolution
  • Through-hole barrel filling
  • Wave and selective soldering issues
  • Black pad: Lessons learned
  • Pb-contamination

The week two sessions focus on the causes, remedies, and preventive measures for production defects associated with bare PCBs and components.
Topics include:

  • BGA solder ball drop
  • PBGA crack
  • BGA/CSP interposer heat damage
  • BGA/CSP co-planarity issue
  • Large BGA rework challenge
  • Ceramic capacitor damage
  • SOT issue
  • Tome stoning
  • 01001 component issue
  • PCB board sagging
  • PCB-related issues
  • PCB pad-cratering
  • PCB pad lifting
  • PCB bare board issues
  • Thermal damages
  • Overall defects and product failure prevention
     

The course is suitable for all who are involved with or interested in solving and preventing production problems through the understanding of the likely causes of each production issue, including designers, quality, manufacturing and reliability professionals, researchers, managers, and business decision-makers; also designed for those who desire to acquire the broad-based understanding of the subject.

IPC offers different instructional modalities to suit participants with different needs and preferences. This program is only available in the following modality:

Online-instructor-led: Participants go online to meet with an IPC-certified industry expert at a fixed time twice per week for the duration of the course. Class sessions are usually 1.5 to 2 hours. Participants can also access a video recording of each class session on their IPC EDGE course dashboard.

Dr. Jennie Hwang

An International Hall of Famer of Women in Technogy, Dr. Hwang brings deep knowledge and comprehensive experience to this course through both hands-on and advisory capacities. She has provided solutions to the most challenging issues in production yield and high reliability products, covering commercial and military applications. She is author of seven internationally-used textbooks and 675+ publications; a featured speaker in innumerable international/national events; has received numerous honors/ awards; on Board of NYSE Fortune 500 companies and on various civic, government and university boards and committees (e.g., DoD - Globalization Committee, DoD - Forecasting Future Disruptive Technologies Committee; National Materials & Manufacturing Board; Board of Army Science and Technology; and NIST Technical Assessment Board). She is Chair of AI Committee of National Academies; Chair of National Laboratory Assessment Board; Chair of Assessment Board of Army Research Laboratory; Chair of Assessment Board of Army Engineering Centers; external panel of National AI Institute of NSF. Her formal education includes Harvard Business School Executive Program; four academic degrees in Metallurgical Engineering and Materials Science, Physical Chemistry, Organic Chemistry, and liquid Crystal Science (Ph.D. M.S., M.S., B.S.). She has held senior executive positions with Lockheed Martin Corp. and CEO of International Electronic Materials Corp., among others. She is also an invited distinguished adj. Professor of Engineering School of Case Western Reserve University and serves on the University’s Board of Trustees. Further Info: www.JennieHwang.com