Download the syllabus.

Module 1: Component Considerations

• Differentiate component packages from component packaging
• Differentiate between leaded and leadless component packages
• Describe the characteristics of the most common SMT components
• Identify and describe the function of the most common reference designators
• Explain the characteristics of moisture sensitive devices (MSDs)
• Handle moisture sensitive devices (MSDs) according to manufacturer requirements 
• Use processes and tools to protect moisture sensitive devices (MSDs)

Module 2: Pick and Place Machines

• Describe the function of the pick-and-place machine
• Set up the correct parameters for the pick-and-place machine
• Describe the function of different feeder types
• Distinguish between different feeder types
• Describe the function of different tray types
• Distinguish between different tray types
• Identify fiducial types and shapes
• Determine the optimal component placement sequence
• Select the optional component placement sequence
• Explain the role and function of a pick-and-place nozzle
• Explain the role of the vision system in the pick-and-place process
• Explain the importance of proper PCB support in the pick-and-place process
• Define the role of the PCB handling strips in the assembly process

Module 3: Reflow and Cure Considerations

• Describe the convection reflow soldering process
• Explain the factors used to determine the reflow oven recipe
• Set reflow oven parameters according to best practices
• Describe the four sections of a reflow profile
• Describe why and how thermocouples are used to measure reflow oven temperatures
• Use a thermal profiler to test and adjust your reflow profile

Participants must complete the Final Exam with a passing score of 80% to access and download their IPC Manufacturing Engineer – Surface Mount Technology Certificate of Completion. Students may attempt the exam up to three (3) times. Please note that a third and final attempt is permitted after 24 hours of the second attempt.