Printed Board Assembly By Design

The landscape of manufacturing design is undergoing a monumental shift. This evolution is spurred by breakthroughs in automobile electrification, the commercial rise of space activities, revolutionary medical electronics, and an increasing emphasis on flawless assembly processes.

Design the future today. Dive into the intricacies of contemporary DFM, from component-specific needs to the effects of printed board designs on assembly.

Key Takeaways:

  • Navigate evolving component technology.
  • Identify printed board fabrication challenges.
  • Understand assembly process implications.
  • Adopt the manufacturing-by-design approach.
  • Equip yourself with the expertise to tackle today's DFM challenges.

 


 

Precio para miembros
$235.00
Nonmember Price
$315.00
Acceso
90 Días a partir de la Inscripción
Class Schedule

  • Nivel del Curso: Intermediate

  • Tiempo del Curso

    1 week (2 two-hour online instructor-led sessions)

  • Certificado Obtenido

  • Seasonal Enrollment

    Acceso durante 90 Días

Preguntas

¿Necesita saber más? Envíanos tus preguntas y te daremos una respuesta.

Download the syllabus. All virtual class sessions are recorded for review.

SESSION 1 – COMPONENT PACKAGING AND PRINTED BOARD DESIGN

Program overview outlining class schedule and options for accessing class materials and assignments. Class session will focus on component packaging and printed board design concepts.

Topics include:

  • DFM History Overview
  • Component Packaging Technology 
  • Supplier Documentation Completeness and Accuracy
  • Printed Board Design and Fabrication
  • Printed Board Design and Supplier Driven Assembly Issues
  • Assembly Tooling, Materials and Process Design  
  • IPC Standards and Limitations

SESSION 2 – ASSEMBLY AND PROCESS DESIGN, TOLERANCE 

Class session will focus on assembly and process design/limitations, and assembly tolerance analysis.

Topics include:

  • Effects of Improper Assembly Tooling and Process Design
  • Impacts of Design on Process Control 
  • PTH and SMT Thermal Connection and Non-STD Geometry Impacts
  • Design for Aqueous Cleaning Overview
  • Assembly Tolerance and Process Effects Analysis

Knowledge Check
•    Complete during Session 2
 

This course designed to provide Manufacturing/Process, Quality and Reliability Engineers, Managers or Technicians that are involved with the design, fabrication, assembly of printed board assemblies with a balanced foundation of theoretical knowledge and practical skills in DFM for today’s complex designs. 

IPC offers different instructional modalities to suit participants with different needs and preferences. This program is only available in the following modality:

Online-instructor-led: Participants go online to meet with an IPC-certified industry expert at a fixed time twice per week for the duration of the course. Class sessions are usually 1.5 to 2 hours. Participants can also access a video recording of each class session on their IPC EDGE course dashboard.

Dale Lee

Dale Lee is a senior staff DFX strategy engineer with Plexus Corporation, primarily involved with DFX analysis and definition/correlation of design, process, and tooling impacts on printed board fabrication/assembly processes, manufacturing yields and reliability. He has served in several industry conferences, technical programs and consortium as an author, instructor and speaker on advanced packaging, PCB and SMT design, assembly DFX and rework and as a technical conference technical committee advisor/participant. He is also a past IPC President's Award recipient.