Reliability of Electronics – Role of Solder Joint Voids

In today’s electronics industry, solder joint voids pose a critical challenge to product performance and longevity. As miniaturization and advanced packaging techniques push the boundaries of design, understanding and mitigating solder joint voids is essential for engineers, designers, and manufacturing professionals.

Course Highlights:

  • Identify key causes and effects of solder joint voids
  • Explore best practices to minimize voids and improve product reliability
  • Learn from real-world case studies and industry standards (IPC-J-STD-001, IPC-A-610, IPC-7093, IPC-7095)
  • Engage with industry-leading knowledge and apply it to your own manufacturing challenges
Precio para miembros
$300.00
Nonmember Price
$400.00
Acceso
90 Días a partir de la Inscripción
Class Schedule

  • Nivel del Curso: Intermediate

  • Tiempo del Curso

    1 week (2 two-hour online instructor-led sessions)

  • Certificado Obtenido

  • Seasonal Enrollment

    Acceso durante 90 Días

Preguntas

¿Necesita saber más? Envíanos tus preguntas y te daremos una respuesta.

Download the syllabus.

Session one will focus on potential effects and causes

  • Likely impact on Reliability
  • Different sources and causes of voids
  • Factors contributing to each of the sources and causes including surface finish
  • Case studies
  • Role of solder alloy composition

Session two will focus on mitigating approaches

  • BGA voiding – additional factors
  • BTC solder joint voids – thermal pads
  • Voids criteria vs. applications
  • Inspection
  • Summary & recommendations

ASSIGNMENT:
Participants to bring further questions and issues for discussion.
 

Designers, engineers, researchers, managers and business decision makers concerned about the impact of solder joint voids on product reliability.

IPC offers different instructional modalities to suit participants with different needs and preferences. This program is only available in the following modality:

Online-instructor-led: Participants go online to meet with an IPC-certified industry expert at a fixed time twice per week for the duration of the course. Class sessions are usually 1.5 to 2 hours. Participants can also access a video recording of each class session on their IPC EDGE course dashboard.

Jennie Hwang

An International Hall of Famer of Women in Technogy, Dr. Hwang brings deep knowledge and comprehensive experience to this course through both hands-on and advisory capacities. She has provided solutions to the most challenging issues in production yield and high reliability products, covering commercial and military applications. She is author of seven internationally-used textbooks and 675+ publications; a featured speaker in innumerable international/national events; has received numerous honors/ awards; on Board of NYSE Fortune 500 companies and on various civic, government and university boards and committees (e.g., DoD - Globalization Committee, DoD - Forecasting Future Disruptive Technologies Committee; National Materials & Manufacturing Board; Board of Army Science and Technology; and NIST Technical Assessment Board). She is Chair of AI Committee of National Academies; Chair of National Laboratory Assessment Board; Chair of Assessment Board of Army Research Laboratory; Chair of Assessment Board of Army Engineering Centers; external panel of National AI Institute of NSF. Her formal education includes Harvard Business School Executive Program; four academic degrees in Metallurgical Engineering and Materials Science, Physical Chemistry, Organic Chemistry, and liquid Crystal Science (Ph.D. M.S., M.S., B.S.). She has held senior executive positions with Lockheed Martin Corp. and CEO of International Electronic Materials Corp., among others. She is also an invited distinguished adj. Professor of Engineering School of Case Western Reserve University and serves on the University’s Board of Trustees. Further Info: www.JennieHwang.com