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Reliability of Electronics – Role of Intermetallic Compounds
Member Price
$300.00
Nonmember Price
$400.00
Access
90 Days From Enrollment
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Course Level: Intermediate
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Training Time
1 week (2 two-hour online instructor-led sessions) -
Certificate of Completion
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Seasonal Enrollment
Access for 90 Days
WEEK 1
Topics include:
- Intermetallic compounds – definition, fundamentals, characteristics
- Role of phase diagrams of Pb-free vs. SnPb
- Intermetallic compounds in the intrinsic material- Pb-free vs. SnPb
- Formation and growth during production process and product service life
- Intermetallic compounds - at-interface vs. in-bulk
- Failure phenomena as the result of IMCs
- Effects from substrate compositions (hybrid module thick film pads, PCB surface finish, IC package component surface coating)
- Gold embrittlement – phenomena, factors, criteria
- Different types of intermetallic compounds – effects on solder joint reliability (Ni/Au, Ni/Pd/Au, Ni/Pd, Cu)
- SAC alloys incorporated with various doping elements – characteristics, performance
- “Low-Temperature” solders – critical areas to product reliability
- Effects on failure mode
- Effects on reliability
- Selected case studies
- Summary
This course provides working knowledge and practical insights to anyone who is concerned about reliability or interested in understanding the relationship between product reliability and solder joint behavior in relation to intermetallic compounds. This includes designers, researchers, managers, quality, manufacturing, and reliability professionals, as well as business decision-makers.
IPC offers different instructional modalities to suit participants with different needs and preferences. This program is only available in the following modality:
Online-instructor-led: Participants go online to meet with an IPC-certified industry expert at a fixed time twice per week for the duration of the course. Class sessions are usually 1.5 to 2 hours. Participants can also access a video recording of each class session on their IPC EDGE course dashboard.
Other Courses
This course aims to enhance product reliability and maintain high production yields by offering comprehensive insights into solder joint voids. We will explore the origins of these voids, understand Learn More