Reliability of Electronics – Role of Solder Joint Voids

In today’s electronics industry, solder joint voids pose a critical challenge to product performance and longevity. As miniaturization and advanced packaging techniques push the boundaries of design, understanding and mitigating solder joint voids is essential for engineers, designers, and manufacturing professionals.

Course Highlights:

  • Identify key causes and effects of solder joint voids
  • Explore best practices to minimize voids and improve product reliability
  • Learn from real-world case studies and industry standards (IPC-J-STD-001, IPC-A-610, IPC-7093, IPC-7095)
  • Engage with industry-leading knowledge and apply it to your own manufacturing challenges
Member Price
$300.00
Nonmember Price
$400.00

Access
90 Days From Enrollment
  • Course Level: Intermediate

  • Training Time

    1 week (2 two-hour online instructor-led sessions)
  • Certificate of Completion

  • Seasonal Enrollment

    Access for 90 Days

Questions

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