Education Catalog

In this course, we will review the data produced by factory machines such as SMT and test equipment and how AI tools can be leveraged to assist with the analysis and interpretation of the data. The course is designed around practical, interactive learning experiences with an anonymized real-world dataset and freely available analysis and visualization tools.  AI agents and copilots will be directly created live in the course using UI tools to visually illustrate the conce…

In industries where precision and reliability are non-negotiable, from healthcare to automotive, aerospace, and beyond, the presence of counterfeit electronic components can spell disaster. Not only do these components have the potential to cause significant financial loss, but they also pose serious risks to safety and could be life-threatening.

This course addresses specific design challenges encountered in military and aerospace applications, including the effects of vibration, shock, radiation, and altitude, extended operating temperature range, and other design considerations for high reliability applications. PCB Design for Military & Aerospace Applications also focuses on the impact of these designs on manufacturing and assembly techniques, documentation, and manufacturing file generation.

How solder alloys are expected to perform in harsh environments will be summarized. Participants are encouraged to bring their own selected systems for deliberation.

This course aims to enhance product reliability and maintain high production yields by offering comprehensive insights into solder joint voids. We will explore the origins of these voids, understand their causes, and analyze their impacts on solder joint efficacy and overall product dependability.

This course provides a holistic coverage on relevant aspects of tin whiskers, including both physical and phenomenal occurrences, as well as fundamental scientific perspectives. We’ll explore various measures to mitigate tin whiskers, as well as their relative effectiveness, and encourage you to join us in questioning and discussing ideas for future solutions.

Discover practical solutions to common manufacturing challenges in the SMT process. Taught by Dr. Jennie Hwang, a globally recognized leader in electronics manufacturing and reliability, this course delves into the root causes of solder joint and assembly defects and provides actionable strategies to prevent them. Ideal for professionals seeking to enhance yield, reduce costs, and ensure product reliability, Module 1 equips participants with real-world insights and engin…

Gain practical knowledge and actionable strategies for preventing and resolving production floor defects. By examining the root causes and contributing factors of common defects, this course focuses on manufacturing challenges related to bare PCBs, PCB fabrication, and components.