Education Catalog

本课程向学员介绍电子制造中最常见的安全实践和工作场所危害。完成本课程后，学员将能够使用旨在确保您和您的同事在制造工厂内安全的关键工具、材料和流程。

能够运用关键工具、材料和工艺流程设计来预防和控制生产场所内的 ESD 影 响。

本课程向参与者介绍 FOD 的成因及在组装车间处理、储存或运输物品时减轻 FOD 影响您可以采 取的步骤。

This course introduces participants to the causes of ESD and the steps you can take to mitigate its effects when handling, storing or transporting ESD-sensitive components in a manufacturing facility. These preventive measures and their application are based on ANSI/ESD S20.20 and other relevant standards.

This course introduces participants to the causes of Foreign Object Debris (FOD) and the steps you can take to mitigate its effects when handling, storing, or transporting items in a manufacturing facility. After completing this course, you will be able to employ the key tools, materials, and processes designed to prevent and control the effects of FOD within a manufacturing facility.

This two to four-hour course facilitates mastery of the key concepts required for successful printed circuit board troubleshooting and defect analysis.

In the competitive printed circuit board fabrication industry, high reliability and high yields are crucial for profitability. That's why process and manufacturing engineers involved in fabrication, assembly, and procurement need to have the necessary knowledge and skills to produce and evaluate top-quality printed circuit boards. This includes understanding materials, chemical processes, equipment parameters, and their impact on board quality. After completing this course, you will be able to: Identify and correct control processes that negatively affect circuit board quality Establish the root cause of potential defects to minimize and prevent loss of quality Recognize the interrelationships of PCB materials, processes, and equipment and how these relationships affect PCB and PCA quality Identify the root cause and corrective action for PCB defects, such as interconnect separation, delamination, wedge voids, plating folds, microvoids, surface pitting, and hole wall pull-away Identify the root cause and corrective action for electrodeposition defects, such as mouse bites, pitting, and domed or crown plating Identify the root cause and corrective action for solderability and assembly-related issues, such as outgassing, black pad, creep corrosion, and blow holes

Master the essentials of PCB Fabrication for Operators with a course that guides you step-by-step through each phase of the process. You’ll gain practical, in-depth knowledge about everything from inner-layer fabrication and lamination to solder mask application, surface finishes, and final testing

This course is ideal for operators, technicians, supervisory personnel and other staff members that must consistently and effectively employ the key tools, materials, and processes designed to keep workers safe within a manufacturing facility.