Result
CFX 100 is the first in this 3-part educational series designed to build IPC-CFX expertise. These short, engaging courses provide a comprehensive overview of CFX and machine communication as well as the base requirements for you and your company to get started with CFX. By the end of the series, you will be ready to start sending IPC-CFX messages.
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This introductory module provides an overview of CFX and addresses some fundamental questions, including: What exactly is CFX? Who benefits from CFX? and What challenges does CFX address?
This two to four-hour course facilitates mastery of the key concepts required for successful printed circuit board troubleshooting and defect analysis.
In the competitive printed circuit board fabrication industry, high reliability and high yields are crucial for profitability. That's why process and manufacturing engineers involved in fabrication, assembly, and procurement need to have the necessary knowledge and skills to produce and evaluate top-quality printed circuit boards. This includes understanding materials, chemical processes, equipment parameters, and their impact on board quality.
After completing this course, you will be able to:
Identify and correct control processes that negatively affect circuit board quality
Establish the root cause of potential defects to minimize and prevent loss of quality
Recognize the interrelationships of PCB materials, processes, and equipment and how these relationships affect PCB and PCA quality
Identify the root cause and corrective action for PCB defects, such as interconnect separation, delamination, wedge voids, plating folds, microvoids, surface pitting, and hole wall pull-away
Identify the root cause and corrective action for electrodeposition defects, such as mouse bites, pitting, and domed or crown plating
Identify the root cause and corrective action for solderability and assembly-related issues, such as outgassing, black pad, creep corrosion, and blow holes
Master the essentials of PCB Fabrication for Operators with a course that guides you step-by-step
through each phase of the process. You’ll gain practical, in-depth knowledge about everything from
inner-layer fabrication and lamination to solder mask application, surface finishes, and final testing