Education Catalog

In this course, participants will learn how to identify and determine the value of the most common electronic components used in PCB assembly, as well as how to use component markings and assembly documentation to ensure their correct orientation and placement.

本课程向学员介绍电子制造中最常见的安全实践和工作场所危害。完成本课程后，学员将能够使用旨在确保您和您的同事在制造工厂内安全的关键工具、材料和流程。

能够运用关键工具、材料和工艺流程设计来预防和控制生产场所内的 ESD 影 响。

本课程向参与者介绍 FOD 的成因及在组装车间处理、储存或运输物品时减轻 FOD 影响您可以采 取的步骤。

Engineers make decisions every day that impact manufacturing. Make sure it's a positive impact by introducing the key concepts, tools, materials, and processes critical for engineers to succeed in electronics assembly.

This course introduces the key concepts, tools, materials, and processes that operators need to know to do their best work. Participants can complete the core set of modules to receive their certificate of qualification, then select among nine voluntary modules for process-specific training.

Help your team enhance product reliability, reduce rework and scrap, and ensure customer satisfaction. This comprehensive overview of process control methodology will empower technicians and engineers to utilize the IPC-A-610 Standard and its associated Handbook to consistently meet acceptance criteria throughout the assembly process.

A comprehensive overview of process control methodology including how to utilize the IPC-J-STD-001 Standard and its associated Handbook to consistently conform to acceptance criteria throughout the assembly process.

This course introduces participants to the causes of ESD and the steps you can take to mitigate its effects when handling, storing or transporting ESD-sensitive components in a manufacturing facility. These preventive measures and their application are based on ANSI/ESD S20.20 and other relevant standards.

This course introduces participants to the causes of Foreign Object Debris (FOD) and the steps you can take to mitigate its effects when handling, storing, or transporting items in a manufacturing facility. After completing this course, you will be able to employ the key tools, materials, and processes designed to prevent and control the effects of FOD within a manufacturing facility.

This Inspection of Electronic Assemblies: Introduction course trains participants to perform "incoming inspection" using the essential tools, materials, and processes that deliver consistent quality products. Completion of this course delivers a professional level of proficiency in acceptability standards, inspection methods and tools, documentation, and component characteristics. 

This course provides a practical introduction to the terms, concepts, and acceptability criteria of the IPC-A-610 standard as they apply to the role of the operator.

This course provides a practical introduction to the terms, concepts, and acceptability requirements of the IPC J-STD-001 standard as they apply to the role of the operator.

Onboarding manufacturing engineers new to the electronics industry can be a daunting task. What if you had a self-paced course that provides a comprehensive overview of the roles and responsibilities of manufacturing engineers in our industry? IPC worked with industry subject-matter experts and instructional designers to create an introductory course that takes approximately 3-1/2 hours to complete. In addition to understanding the role, participants will also learn to use documentation control systems, product identification, and product traceability.

A comprehensive overview of the stencil printing process for a manufacturing engineer. Participants will learn how to select and store solder pastes & adhesives. They will also learn how to create and maintain stencils, the function of the stencil printer, as well as how to set up the stencil printer for a new product introduction, or NPI, run.

This course provides a comprehensive overview of the surface mount assembly process including information on component considerations, selecting and setting up pick and place machines, and the reflow process. Participants can take this content-specific course to learn more about the role of manufacturing engineers regardless of company size and industry sector.

This course provides a comprehensive overview of component preparation, tool selection, manual component insertion, and automated component insertion in electronics assembly with through-hole components. Participants can take this content-specific course to learn more about the role of manufacturing engineers regardless of company size and industry sector.  

This course addresses specific design challenges encountered in military and aerospace applications, including the effects of vibration, shock, radiation, and altitude, extended operating temperature range, and other design considerations for high reliability applications. PCB Design for Military & Aerospace Applications also focuses on the impact of these designs on manufacturing and assembly techniques, documentation, and manufacturing file generation.

How solder alloys are expected to perform in harsh environments will be summarized. Participants are encouraged to bring their own selected systems for deliberation.

This course aims to enhance product reliability and maintain high production yields by offering comprehensive insights into solder joint voids. We will explore the origins of these voids, understand their causes, and analyze their impacts on solder joint efficacy and overall product dependability.

This course is ideal for operators, technicians, supervisory personnel and other staff members that must consistently and effectively employ the key tools, materials, and processes designed to keep workers safe within a manufacturing facility.

Discover practical solutions to common manufacturing challenges in the SMT process. Taught by Dr. Jennie Hwang, a globally recognized leader in electronics manufacturing and reliability, this course delves into the root causes of solder joint and assembly defects and provides actionable strategies to prevent them. Ideal for professionals seeking to enhance yield, reduce costs, and ensure product reliability, Module 1 equips participants with real-world insights and engineering principles to tackle production floor issues effectively.

Gain practical knowledge and actionable strategies for preventing and resolving production floor defects. By examining the root causes and contributing factors of common defects, this course focuses on manufacturing challenges related to bare PCBs, PCB fabrication, and components.

Learn how to create industry acceptable solder joints for through-hole and surface mount chip and gull wing components. This innovative multimedia course capitalizes on the power of the hear-see-do methodology to equip students with actionable techniques and best practices they can immediately apply on the job. Students will learn key concepts, tools, and techniques, then use the accompanying practice and project boards, available here, to practice and demonstrate their new skills.

Learn how to mitigate the health and safety risks associated with soldering. The course covers various topics, including the hazards related to soldering tools and materials, implementing effective safety measures, and maintaining a safe soldering environment.

Equip your team to quickly and effectively identify, analyze, and address PCBA production defects. Jim Hall and Phil Zarrow, the authors of Troubleshooting for Electronics Manufacturing and the acclaimed BoardTalk podcast, offer decades of practical insights that students can immediately use to increase reliability, yields, and cost savings.