Result
Unleash the potential of wire harness design with our course led by IPC-certified expert Didem Üstün. This two-week intensive program transforms newcomers into skilled designers ready to tackle the complicated challenges of the modern wire harness industry.
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Discover practical solutions to common manufacturing challenges in the SMT process. Taught by Dr. Jennie Hwang, a globally recognized leader in electronics manufacturing and reliability, this course delves into the root causes of solder joint and assembly defects and provides actionable strategies to prevent them. Ideal for professionals seeking to enhance yield, reduce costs, and ensure product reliability, Module 1 equips participants with real-world insights and engineering principles to tackle production floor issues effectively.
Gain practical knowledge and actionable strategies for preventing and resolving production floor defects. By examining the root causes and contributing factors of common defects, this course focuses on manufacturing challenges related to bare PCBs, PCB fabrication, and components.