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CFX 100 is the first in this 3-part educational series designed to build IPC-CFX expertise. These short, engaging courses provide a comprehensive overview of CFX and machine communication as well as the base requirements for you and your company to get started with CFX. By the end of the series, you will be ready to start sending IPC-CFX messages.

Présentez aux participants les causes des décharges électrostatiques et les mesures que vous pouvez prendre pour atténuer leurs effets lors de la manipulation, du stockage ou du transport de composants sensibles aux décharges électrostatiques dans une usine de fabrication. Ces mesures préventives et leur application sont basées sur ANSI/ESD S20.20 et d'autres normes pertinentes.

IPC E-Textiles Exchange is a free and open online community for the e-textiles industry to learn, collaborate, and engage. Each month, IPC will post new video presentations and Deeper Dive discussions with subject matter experts from around the world. The community also includes a discussion board for members to interact with others in the IPC E-Textiles Exchange community.

Help your team enhance product reliability, reduce rework and scrap, and ensure customer satisfaction. This comprehensive overview of process control methodology will empower technicians and engineers to utilize the IPC-A-610 Standard and its associated Handbook to consistently meet acceptance criteria throughout the assembly process.

This course introduces participants to the causes of ESD and the steps you can take to mitigate its effects when handling, storing or transporting ESD-sensitive components in a manufacturing facility. These preventive measures and their application are based on ANSI/ESD S20.20 and other relevant standards.

Stellen Sie den Teilnehmern die Ursachen von ESD und die Maßnahmen vor, die Sie ergreifen können, um ihre Auswirkungen bei der Handhabung, Lagerung oder dem Transport von ESD-empfindlichen Komponenten in einer Produktionsstätte zu mindern. Diese vorbeugenden Maßnahmen und ihre Anwendung basieren auf ANSI/ESD S20.20 und anderen relevanten Standards.

This course introduces participants to the causes of Foreign Object Debris (FOD) and the steps you can take to mitigate its effects when handling, storing, or transporting items in a manufacturing facility. After completing this course, you will be able to employ the key tools, materials, and processes designed to prevent and control the effects of FOD within a manufacturing facility.

This Inspection of Electronic Assemblies: Introduction course trains participants to perform "incoming inspection" using the essential tools, materials, and processes that deliver consistent quality products. Completion of this course delivers a professional level of proficiency in acceptability standards, inspection methods and tools, documentation, and component characteristics.

Onboarding manufacturing engineers new to the electronics industry can be a daunting task. What if you had a self-paced course that provides a comprehensive overview of the roles and responsibilities of manufacturing engineers in our industry? IPC worked with industry subject-matter experts and instructional designers to create an introductory course that takes approximately 3-1/2 hours to complete. In addition to understanding the role, participants will also learn to use documentation control systems, product identification, and product traceability.

A comprehensive overview of the stencil printing process for a manufacturing engineer. Participants will learn how to select and store solder pastes & adhesives. They will also learn how to create and maintain stencils, the function of the stencil printer, as well as how to set up the stencil printer for a new product introduction, or NPI, run.

This course provides a comprehensive overview of the surface mount assembly process including information on component considerations, selecting and setting up pick and place machines, and the reflow process. Participants can take this content-specific course to learn more about the role of manufacturing engineers regardless of company size and industry sector.

This course provides a comprehensive overview of component preparation, tool selection, manual component insertion, and automated component insertion in electronics assembly with through-hole components. Participants can take this content-specific course to learn more about the role of manufacturing engineers regardless of company size and industry sector.

In the competitive printed circuit board fabrication industry, high reliability and high yields are crucial for profitability. That's why process and manufacturing engineers involved in fabrication, assembly, and procurement need to have the necessary knowledge and skills to produce and evaluate top-quality printed circuit boards. This includes understanding materials, chemical processes, equipment parameters, and their impact on board quality.
After completing this course, you will be able to:
Identify and correct control processes that negatively affect circuit board quality
Establish the root cause of potential defects to minimize and prevent loss of quality
Recognize the interrelationships of PCB materials, processes, and equipment and how these relationships affect PCB and PCA quality
Identify the root cause and corrective action for PCB defects, such as interconnect separation, delamination, wedge voids, plating folds, microvoids, surface pitting, and hole wall pull-away
Identify the root cause and corrective action for electrodeposition defects, such as mouse bites, pitting, and domed or crown plating
Identify the root cause and corrective action for solderability and assembly-related issues, such as outgassing, black pad, creep corrosion, and blow holes

Ce cours présente aux participants les pratiques de sécurité et les risques professionnels les plus courants dans la fabrication de produits électroniques. Après avoir terminé ce cours, les participants seront en mesure d'utiliser les principaux outils, matériaux et processus conçus pour assurer votre sécurité et celle de vos collègues dans une usine de fabrication.

Dieser Kurs macht die Teilnehmer mit den häufigsten Sicherheitspraktiken und Gefahren am Arbeitsplatz in der Elektronikfertigung vertraut. Nach Abschluss dieses Kurses sind Sie in der Lage, die wichtigsten Instrumente, Materialien und Verfahren, die für Ihre eigene Sicherheit und die Ihrer Mitarbeiter in einer Produktionsanlage vorgesehen sind, einzusetzen.

Learn how to create industry acceptable solder joints for through-hole and surface mount chip and gull wing components. This innovative multimedia course capitalizes on the power of the hear-see-do methodology to equip students with actionable techniques and best practices they can immediately apply on the job. Students will learn key concepts, tools, and techniques, then use the accompanying practice and project boards, available here, to practice and demonstrate their new skills.