Result

In this course, we will review the data produced by factory machines such as SMT and test equipment and how AI tools can be leveraged to assist with the analysis and interpretation of the data. The course is designed around practical, interactive learning experiences with an anonymized real-world dataset and freely available analysis and visualization tools. AI agents and copilots will be directly created live in the course using UI tools to visually illustrate the concepts and show what is possible with current technologies.

In industries where precision and reliability are non-negotiable, from healthcare to automotive, aerospace, and beyond, the presence of counterfeit electronic components can spell disaster. Not only do these components have the potential to cause significant financial loss, but they also pose serious risks to safety and could be life-threatening.

Help your team enhance product reliability, reduce rework and scrap, and ensure customer satisfaction. This comprehensive overview of process control methodology will empower technicians and engineers to utilize the IPC-A-610 Standard and its associated Handbook to consistently meet acceptance criteria throughout the assembly process.

In the competitive printed circuit board fabrication industry, high reliability and high yields are crucial for profitability. That's why process and manufacturing engineers involved in fabrication, assembly, and procurement need to have the necessary knowledge and skills to produce and evaluate top-quality printed circuit boards. This includes understanding materials, chemical processes, equipment parameters, and their impact on board quality.
After completing this course, you will be able to:
Identify and correct control processes that negatively affect circuit board quality
Establish the root cause of potential defects to minimize and prevent loss of quality
Recognize the interrelationships of PCB materials, processes, and equipment and how these relationships affect PCB and PCA quality
Identify the root cause and corrective action for PCB defects, such as interconnect separation, delamination, wedge voids, plating folds, microvoids, surface pitting, and hole wall pull-away
Identify the root cause and corrective action for electrodeposition defects, such as mouse bites, pitting, and domed or crown plating
Identify the root cause and corrective action for solderability and assembly-related issues, such as outgassing, black pad, creep corrosion, and blow holes

This course provides a holistic coverage on relevant aspects of tin whiskers, including both physical and phenomenal occurrences, as well as fundamental scientific perspectives. We’ll explore various measures to mitigate tin whiskers, as well as their relative effectiveness, and encourage you to join us in questioning and discussing ideas for future solutions.

Discover practical solutions to common manufacturing challenges in the SMT process. Taught by Dr. Jennie Hwang, a globally recognized leader in electronics manufacturing and reliability, this course delves into the root causes of solder joint and assembly defects and provides actionable strategies to prevent them. Ideal for professionals seeking to enhance yield, reduce costs, and ensure product reliability, Module 1 equips participants with real-world insights and engineering principles to tackle production floor issues effectively.