Manufacturing Engineering for Electronics Assembly: Surface Mount Technology

This course provides a comprehensive overview of the surface mount assembly process including information on component considerations, selecting and setting up pick and place machines, and the reflow process. Participants can take this content-specific course to learn more about the role of manufacturing engineers regardless of company size and industry sector.

Member Price
200,00 $
Non-member Price
275,00 $
Access
90 Days From Enrollment

  • Course Level: Intermediate

  • Training Time

    3 modules/approx. 4hr

  • Certificate of Completion

  • Continuous Enrollment

    Access for 90 Days

Questions

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Download the syllabus.

Module 1: Component Considerations

  • Differentiate component packages from component packaging
  • Differentiate between leaded and leadless component packages
  • Describe the characteristics of the most common SMT components
  • Identify and describe the function of the most common reference designators
  • Explain the characteristics of moisture sensitive devices (MSDs)
  • Handle moisture sensitive devices (MSDs) according to manufacturer requirements 
  • Use processes and tools to protect moisture sensitive devices (MSDs)

Module 2: Pick and Place Machines

  • Describe the function of the pick-and-place machine
  • Set up the correct parameters for the pick-and-place machine
  • Describe the function of different feeder types
  • Distinguish between different feeder types
  • Describe the function of different tray types
  • Distinguish between different tray types
  • Identify fiducial types and shapes
  • Determine the optimal component placement sequence
  • Select the optional component placement sequence
  • Explain the role and function of a pick-and-place nozzle
  • Explain the role of the vision system in the pick-and-place process
  • Explain the importance of proper PCB support in the pick-and-place process
  • Define the role of the PCB handling strips in the assembly process

Module 3: Reflow and Cure Considerations

  • Describe the convection reflow soldering process
  • Explain the factors used to determine the reflow oven recipe
  • Set reflow oven parameters according to best practices
  • Describe the four sections of a reflow profile
  • Describe why and how thermocouples are used to measure reflow oven temperatures
  • Use a thermal profiler to test and adjust your reflow profile

Participants must complete the Final Exam with a passing score of 80% to access and download their IPC Manufacturing Engineer – Surface Mount Technology Certificate of Completion. Students may attempt the exam up to three (3) times. Please note that a third and final attempt is permitted after 24 hours of the second attempt.

Engineers and technicians who want a thorough understanding of the Surface Mount Technology assembly process.

IPC offers different instructional modalities to suit participants with different needs and preferences. This program is available in the following modalities:

Online-self-paced: Participants can access course materials on the IPC EDGE Learning Management System at any time and complete them at their own pace. However, organizations may set completion deadlines, as well as monitor the progress of the participants they register for a course.