Learning Objectives

Download the Syllabus.

Module 1: Conforming to the Criteria

• Define the purpose of the IPC-HDBK-001-H and IPC-J-STD-001
• Interpret IPC standards and handbook to identify preventive actions for assembly issues
• Use IPC guidelines to develop process controls 
• Use product classes and acceptability designators in real-world scenarios
• Implement corrective actions based on IPC standards
• Understand documentation and compliance hierarchy

Module 2:  Process Control

• Understand process control systems and standards
• Develop and implement a process control master plan
• Interpret and use process control data
• Develop a corrective action plan for addressing process variations
• Create and manage inspection and data collection systems
• Develop a system to manage nonconforming assemblies
• Identify and control facility and environmental factors

Module 3: Materials

• Identify common materials in electronics assembly
• Establish material control and validation processes
• Develop controls for different solder forms
• Implement process changes and validate outcomes
• Develop procedures for managing flux types and compatibility
• Explain the functions of different adhesives in electronics assembly
• Select appropriate curing methods for adhesives
• Control chemical stripping and masking processes

Module 4: Tools and Equipment

• Describe the steps and requirements of the soldering process
• Identify and differentiate soldering tools and equipment
• Identify and control key parameters for the soldering process
• Implement best practices for hand soldering
• Understand and apply automated soldering controls
• Create thermal profiles for reflow soldering using temperature monitoring devices
• Apply safety and quality controls in vapor phase soldering
• Define and monitor solder connection quality

Module 5: Components and Surfaces

• Explain solderability and surface finish requirements
• Describe methods for controlling surface finishes to enhance solderability
• Identify common contamination sources for solderable surfaces
• Establish preventive handling and cleaning methods to protect solderable surfaces
• Implement thermal protection and damage prevention methods
• Describe lead forming and mounting techniques for both through-hole and SMT
• Explain proper clinching methods and requirements
• Interpret guidelines for different SMT termination styles
• Describe rework processes for non-solderable parts
• Apply inspection criteria to ensure component alignment and proper fillet formation

Module 6: Wires and Terminals

• Identify different wire stripping methods
• Describe causes of common insulation and strand damage 
• Develop strategies to prevent insulation and strand damage
• Demonstrate proper tinning techniques 
• Differentiate between electrical and mechanical terminal mounting methods
• Describe requirements for wire attachment to terminals

Module 7:  PCB Damage

• Identify common types of PCB damage
• Distinguish between acceptable and defective PCB anomalies
• Explain causes and risks associated with PCB damage
• Implement preventative measures to minimize PCB damage
• Develop procedures to rework or repair damaged PCBs

Module 8: Cleaning

• Identify types and sources of contamination in the assembly process
• Analyze the impact of contamination on assembly performance and reliability
• Interpret and implement cleaning requirements and testing methods
• Develop and document contamination prevention and control processes
• Inspect and evaluate the cleanliness of assemblies

Module 9: Polymerics

• Explain the functions and applications of polymeric materials in electronics assembly
• Differentiate between types and properties of conformal coating materials
• Identify and prevent common conformal coating defects
• Define and implement effective masking techniques for conformal coatings
• Describe techniques for reworking and removing conformal coatings
• Describe appropriate applications for encapsulation (potting) and staking processes
• Interpret requirements for witness stripes on critical assemblies

FINAL EXAM
Participants must complete the Final Exam with a passing score of 80% to access and download their Ensuring Excellence: J-STD-001 Process Optimization Certificate of Completion. Students may attempt the exam up to three (3) times. Please note that a third and final attempt is permitted after 24 hours of the second attempt.