Learning Objectives

Download the syllabus.

Module 1: Introduction

• Define the purpose of the IPC-HDBK-610 and IPC-A-610
• Use cross-reference tables in the IPC-HDBK-610 to locate content in IPC-A-610
• Use product classes and acceptability designators in real-world scenarios
• Define and explain acceptability categories and their functions.
• Use inspection criteria and methodologies to evaluate assemblies 

Module 2:  Electrostatic Discharge

• Explain ESD and its impact on sensitive electronic components
• Differentiate between ESD and electrical overstress (EOS)
• Recognize ESD Sensitivity and Sources
• Describe an ESD-safe workstation
• Formulate and implement an ESD control plan
• Apply ESD Prevention Techniques
• Ensure Proper Handling of ESD-Sensitive Items
• Evaluate and Monitor ESD Safety Measures

Module 3: Mechanical Assembly

• Identify the criteria used to evaluate mechanical assembly
• Define minimum electrical clearance
• Identify the cause of interference in fitting mechanical hardware
• Explain the requirements for mounting high power components
• Define the requirements for mounting heatsinks
• Detail the characteristics of threaded hardware
• Define torque and its impact on assembly
• Identify connector pins and their role in assembly

Module 4: Soldering

• Define the criteria for acceptable solder joint quality
• Identify and explain various soldering methods
• Evaluate solder joint anomalies
• Explain the impact of material solderability on solder joint quality
• Assess solder connections for acceptability based on visual inspection criteria
• Identify the causes and preventive measures for common soldering defects

Module 5: Through-Hole Technology

• Explain the acceptability criteria for forming, mounting, securing, and soldering TH components
• Recognize and discern the implications of common through-hole technology anomalies
• Identify common causes of through-hole technology defects
• Determine corrective actions and process improvements to comply with IPC-A-610 acceptability requirements

Module 6: Surface Mount Assemblies

• Identify the acceptability criteria for surface mount technology (SMT) components 
• Identify common SMT process anomalies
• Identify common causes of SMT defects
• Identify common SMT terminations and explain their impact on the SMT assembly process
• Evaluate process controls and environmental factors that impact SMT assembly quality
• Implement measures to mitigate and prevent common SMT defects
• Describe alternative SMT mounting practices

Module 7:  Component Damage

• Identify the different types of component damage and their consequences
• Identify common causes of component damage
• Use IPC-A-610 to determine if component damage qualifies as a defect
• Implement measures to prevent component damage
• Inspect and maintain tools and equipment

Module 8: Printed Boards and Assemblies

• Identify common printed circuit board (PCB) and assembly (PCBA) anomalies
• Use IPC-A-610 to determine the acceptability of common PCB and PCBA anomalies
• Explain the implications of PCB and PCBA defects
• Determine the common causes of PCB and PCBA defects 
• Implement steps to resolve common causes of PCB and PCBA defects

Module 9: High Voltage

• Explain the importance of IPC-A-610 criteria for high voltage applications
• Identify high-voltage solder joint requirements
• Identify methods to minimize common high-voltage defects
• Demonstrate ball soldering techniques for through-hole and wire terminal connections
• Identify types of flux suitable for high-voltage assemblies
• Identify appropriate cleaning methods to prevent flux residue
• Evaluate solder alloys for high-voltage applications
• Define acceptable insulation clearance for wires in high-voltage applications
• Define methods to prevent insulation damage
• Ensure compliance with maximum component height clearance

Module 10: Jumper Wires

• Define the requirements for selecting and insulating jumper wires
• Describe and implement best practices for routing jumper wires
• Explain the importance of staking jumper wires for Class 2 and 3 products
• Apply staking techniques using adhesive or tape to secure wires effectively
• Demonstrate correct soldering techniques for jumper wires
• Identify common jumper wire anomalies and their consequences
• Develop and follow guidelines to avoid common defects in jumper wire installations

FINAL EXAM

Participants must complete the Final Exam with a passing score of 80% to access and download their Ensuring Excellence: IPC-A-610 Process Optimization Certificate of Completion. Students may attempt the exam up to three (3) times. Please note that a third and final attempt is permitted after 24 hours of the second attempt.