Fundamentals of PCB Fabrication & Assembly

Taught by an IPC-certified industry expert with more than 40 years of experience in the field, this two to four-hour course facilitates mastery of the key concepts required for successful printed circuit board troubleshooting and defect analysis. This comprehensive introduction to the basics of printed circuit board (PCB) and printed wiring assembly (PCA) fabrication will prepare those that have little or no direct experience in either discipline for the Advanced Troubleshooting and Defect Analysis of PCBs course.

After completing this course, you will be able to: 

  • Describe the connection between the various process steps in the fabrication of bare circuit boards and final assembly
  • Recognize the interrelationships of PCB materials, processes, and equipment and how these relationships affect PCB and PCA quality
  • Explain how bare board quality (or lack thereof) leads to poor assembly yields
  • Discussion of solderable finishes and determine the best fit for final assembly 
     
Precio para miembros
$80.00
Precio no Socio
$100.00
Acceso
90 Días a partir de la Inscripción

  • Nivel del Curso: Introducción

  • Tiempo del Curso

    Two modules (4-6 hours)

  • Certificado Obtenido

  • Inscripción continua

    Acceso durante 90 Días

Preguntas

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Download the syllabus.

MODULE  1: OVERVIEW OF BARE BOARD FABRICATION AND FINAL ASSEMBLY
Multilayer Fabrication:

  • Overview of Materials and Resin Systems
  • Inner layer Fabrication: 
    • Surface preparation
    • Imaging and circuit formation:
      • Resist lamination
      • Exposure
      • Develop
      • Etch-strip
    • Inner layer treatment adhesion promotion:
      • Oxide
      • Oxide alternatives 
      • Double treat
      • Process effects due to inner layer treatment
  • Lamination
  • Lay-up
  • Press cycles
  • Post-press cycles
  • Process effects due to lamination

Via Formation and Metallization:

  • Via Formation:
    • Drilling basics
    • Feeds and speeds
    • Drill bit quality
    • Effect of drilling on hole wall quality
    • Causes of drill smear and other drilling-related defects
  • Desmear/Etchback: 
    • Material concerns for desmear/etchback
    • Overview of different desmear techniques
    • Desmear/etchback problems
  • Metallization:
    • Electroless copper basics
    • Direct metallization overview
    • Building reliability into the PTH—Best Practices
    • PTH defects overview—Cause and Effect

Electroplating Technologies:

  • Pattern and Panel Plating:
    • Imaging/developing issues
    • Proper preplate process setup
  • Overview of Plating Process: 
    • Acid copper electroplating/acid tin/tin-lead:
      • Key function of solution ingredients
    • Role of organic additives
    • Mechanical setup
    • Anodes
    • Process control
  • Other finishes:
    • Selective nickel-gold
    • Other
  • Factors Affecting Plating Distribution and Throwing Power: 
    • Mechanical
    • Chemical
    • Shielding/eductors
    • Pulse plating
  • Strip-Etch-Strip
  • Solder Mask Over Bare Copper:
    • Types of solder mask
    • Application methods
    • Properties
  • Overview of Solderable Finishes

Assignment:

  • Module 1 Quiz

MODULE 2: OVERVIEW OF BARE BOARD FABRICATION AND FINAL ASSEMBLY

Circuit Board Assembly: 

  • Assembly in Lead-Free World
  • Surface Mount Process Flow
  • Through-Hole Assembly Process Flow
  • Reflow Profiles
  • Wave Solder Dynamics
  • Solder Paste Types and Solder Paste Special Considerations
  • Optimization of Assembly Parameters:
    • Dual wave
    • Turbulent wave
    • IR reflow dynamics
  • Solderable Finish Selection:
    • HASL
    • OSP
    • ENIG/ENEPIG
    • Immersion silver
    • Immersion tin
    • How these finishes interact with assembly solders
  • Assembly-Related Defects:
    • Design-related issues
    • Solder mask concerns with dewetting
    • Solder balls
    • Outgassing and blowholes
    • Plating voids and impact on assembly yields

Assignment:

  • Module 2 Quiz

FINAL  EXAM
Participants must complete the Final Exam with a passing score of 80% to access and download their Fundamentals of PCB Fabrication & Assembly Certificate. Students may attempt the exam up to three (3) times. Please note that a third and final attempt is permitted after 24 hours of the second attempt.
 

This course is designed for engineers, technicians, operators, and other staff members directly involved in the fabrication, assembly, or purchasing of printed boards. 

IPC offers different instructional modalities to suit participants with different needs and preferences. This program is available in the following modalities:

Online-self-paced: Participants can access course materials on the IPC EDGE Learning Management System at any time and complete them at their own pace. However, organizations may set completion deadlines, as well as monitor the progress of the participants they register for a course.