Troubleshooting and Defect Analysis for Electronics Assembly

Equip your team to quickly and effectively identify, analyze, and address PCBA production defects. Jim Hall and Phil Zarrow, the authors of Troubleshooting for Electronics Manufacturing and the acclaimed BoardTalk podcast, offer decades of practical insights that students can immediately use to increase reliability, yields, and cost savings.

Upon completion, participants will:

  • Understand the nature of defects and how to identify them
  • Evaluate material, equipment, and process factors that contribute to defect formation
  • Apply this background to identify the root cause of specific defects
  • Use this knowledge to optimize assembly processes to prevent defects
Precio para miembros
$625.00
Nonmember Price
$850.00
Acceso
90 Días a partir de la Inscripción
Class Schedule

  • Nivel del Curso: Intermediate

  • Tiempo del Curso

    8 Hours Total over 2 Weeks (4 Hours per Week)

  • Certificado Obtenido

  • Seasonal Enrollment

    Acceso durante 90 Días

Preguntas

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Download the Course Syllabus. 

All virtual class sessions are recorded for review.

WEEK 1 – SESSION 1

Provides an overview of the program: defining, identifying, and analyzing the root cause of defects. It establishes the methodology of troubleshooting which will be presented in detail in subsequent sessions.

Topics include:

  • Introduction
  • Defect Definitions
  • Defect Identification
  • Causes of Defects
  • Root Cause

WEEK 1 – SESSION 2

Presents, in detail, process relationships which contribute to the formation of defects.

Topics include:

  • Process relationships which Interact with multiple processes:
    • Incoming materials
    • MSD
    • ESD
    • Handling (including time)
  • Specific Processes (Part 1):
    • Generic: wrong processes, equipment problem, etc.
    • Labeling
    • Printing
    • Placement

WEEK 2 – SESSION 1

Completes the detailed presentation of process relationships and presents an in-depth example of the application of this troubleshooting methodology using the common defect, solder short.

Topics include:

  • Specific Processes (Part 2):
    • Soldering
    • Cleaning
    • Singulation
    • Coating
    • Mechanical Assembly
    • Inspection & Test
  • Detailed Troubleshooting Example: Solder Short:
    • Defect Definition
    • Detection
    • Cause
    • Relevant Process Relationships

WEEK 2 – SESSION-2

Presents troubleshooting summaries of other common defects using the established methodology. It will explore how to modify current assembly processes to prevent future defects.

Topics include:

  • Troubleshooting Summaries of Common Defects:
    • Opens
    • Delamination
    • Solder Balls
    • Etc.
  • Preventing Defects:
    • Specific existing strategies
    • Process Development and Validation
    • DFM
    • Continuous Improvement

This course is designed for engineers, technicians, operators, and other staff members directly involved in the assembly of printed circuit boards (PCBs).

IPC offers different instructional modalities to suit participants with different needs and preferences. This program is only available in the following modality:

Online-instructor-led: Participants go online to meet with an IPC-certified industry expert at a fixed time twice per week for the duration of the course. Class sessions are usually 1.5 to 2 hours. Participants can also access a video recording of each class session on their IPC EDGE course dashboard.

Jim Hall and Phil Zarrow at IPC APEX EXPO

Jim Hall is a principal consultant and Lean Six Sigma Master Black Belt with ITM Consulting. His area of responsibility includes working with OEMs, contract assemblers, and equipment manufacturers to solve design and assembly problems, optimize facility operations, and teach basic and new technologies in private and public forums  worldwide.

Jim is one of the authors of the highly acclaimed SMTA Process Certification Course, along with Dr. Ron Lasky and Phil Zarrow. He has served as the program’s principal instructor, certifying hundreds or engineers in the US, Canada, Mexico, Hong Kong, and China.

As ITM Consulting’s resident Lean Six Sigma Master Black Belt, Jim is a strong proponent of in-process data capture and analysis for all operations. 

Mr. Hall, one of the pioneers of reflow technology, has been actively involved in electronic assembly technology for more than 40 years. . Jim is co-host of CircuitInsight’s “BoardTalk” audio program.



Phil Zarrow has been involved with PCB fabrication and assembly for more than 45 years. His expertise includes the manufacturing of equipment for circuit board fabrication and assembly of through hole and surface mount technologies. In addition to his background in automated assemblyand cleaning, Mr. Zarrow is recognized for his expertise in surface mount reflow soldering technology as well as for the design and implementation of SMT placement equipment and reflow soldering systems.

Having held key technical and management positions with Vitronics SoltecCorporation, Excellon-Micronetics, and Universal Instruments Corporation, he has extensive hands-on experience with setting up and troubleshooting through hole and SMT processes throughout the world. He was responsible for specifying and setting up medium and high-speed assembly lines as well as investigating and implementing emerging and leading-edge technologies, equipment, and processes during his tenure as director of technology development for GSS Array Technology.