Reliability of Electronics – Role of Solder Joint Voids

The increasing prominence of lead-free solder joints, advanced packaging techniques (like BTCs and PoPs), miniaturized electronics with intricate solder joints, and heightened requirements for solder joint reliability in high-performance, harsh-environment products has intensified the industry's focus on solder joint voids. 

This course aims to enhance product reliability and maintain high production yields by offering comprehensive insights into solder joint voids. We will explore the origins of these voids, understand their causes, and analyze their impacts on solder joint efficacy and overall product dependability. 

By juxtaposing standard acceptance criteria against actual performance, we'll delineate strategies to diminish void occurrences in both array solder ball joints (such as PoP, BGA, CSP) and lead-frame solder joints (like QFP, BTC). In conclusion, we'll emphasize the most detrimental sources of voids to reliability, underscoring the importance of their prevention.
 

Member Price
$300.00
Non-member Price
$400.00
Access
90 Days From Enrollment
Class Schedule

  • Course Level: Intermediate

  • Training Time

    1 week (2 two-hour online instructor-led sessions)

  • Certificate of Completion

  • Seasonal Enrollment

    Access for 90 Days

Questions

Need to know more? Send us your questions and we'll get you an answer.

Session one will focus on potential effects and causes

  • Likely impact on Reliability
  • Different sources and causes of voids
  • Factors contributing to each of the sources and causes including surface finish
  • Case studies
  • Role of solder alloy composition

Session two will focus on mitigating approaches

  • BGA voiding – additional factors
  • BTC solder joint voids – thermal pads
  • Voids criteria vs. applications
  • Inspection
  • Summary & recommendations

ASSIGNMENT:
Participants to bring further questions and issues for discussion.
 

Designers, engineers, researchers, managers and business decision makers concerned about the impact of solder joint voids on product reliability.

IPC offers different instructional modalities to suit participants with different needs and preferences. This program is only available in the following modality:

Online-instructor-led: Participants go online to meet with an IPC-certified industry expert at a fixed time twice per week for the duration of the course. Class sessions are usually 1.5 to 2 hours. Participants can also access a video recording of each class session on their IPC EDGE course dashboard.

Jennie Hwang

An International Hall of Famer of Women in Technogy, Dr. Hwang brings deep knowledge and comprehensive experience to this course through both hands-on and advisory capacities. She has provided solutions to the most challenging issues in production yield and high reliability products, covering commercial and military applications. She is author of seven internationally-used textbooks and 675+ publications; a featured speaker in innumerable international/national events; has received numerous honors/ awards; on Board of NYSE Fortune 500 companies and on various civic, government and university boards and committees (e.g., DoD - Globalization Committee, DoD - Forecasting Future Disruptive Technologies Committee; National Materials & Manufacturing Board; Board of Army Science and Technology; and NIST Technical Assessment Board). She is Chair of AI Committee of National Academies; Chair of National Laboratory Assessment Board; Chair of Assessment Board of Army Research Laboratory; Chair of Assessment Board of Army Engineering Centers; external panel of National AI Institute of NSF. Her formal education includes Harvard Business School Executive Program; four academic degrees in Metallurgical Engineering and Materials Science, Physical Chemistry, Organic Chemistry, and liquid Crystal Science (Ph.D. M.S., M.S., B.S.). She has held senior executive positions with Lockheed Martin Corp. and CEO of International Electronic Materials Corp., among others. She is also an invited distinguished adj. Professor of Engineering School of Case Western Reserve University and serves on the University’s Board of Trustees. Further Info: www.JennieHwang.com

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