Education Catalog

CFX 100 is the first in this 3-part educational series designed to build IPC-CFX expertise. These short, engaging courses provide a comprehensive overview of CFX and machine communication as well as the base requirements for you and your company to get started with CFX. By the end of the series, you will be ready to start sending IPC-CFX messages.

This introductory module provides an overview of CFX and addresses some fundamental questions, including: What exactly is CFX? Who benefits from CFX? and What challenges does CFX address?

In this course, participants will learn how to identify and determine the value of the most common electronic components used in PCB assembly, as well as how to use component markings and assembly documentation to ensure their correct orientation and placement.

本课程向学员介绍电子制造中最常见的安全实践和工作场所危害。完成本课程后，学员将能够使用旨在确保您和您的同事在制造工厂内安全的关键工具、材料和流程。

能够运用关键工具、材料和工艺流程设计来预防和控制生产场所内的 ESD 影 响。

本课程向参与者介绍 FOD 的成因及在组装车间处理、储存或运输物品时减轻 FOD 影响您可以采 取的步骤。

This course introduces the key concepts, tools, materials, and processes that operators need to know to do their best work. Participants can complete the core set of modules to receive their certificate of qualification, then select among nine voluntary modules for process-specific training.

This course introduces participants to the causes of ESD and the steps you can take to mitigate its effects when handling, storing or transporting ESD-sensitive components in a manufacturing facility. These preventive measures and their application are based on ANSI/ESD S20.20 and other relevant standards.

This course introduces participants to the causes of Foreign Object Debris (FOD) and the steps you can take to mitigate its effects when handling, storing, or transporting items in a manufacturing facility. After completing this course, you will be able to employ the key tools, materials, and processes designed to prevent and control the effects of FOD within a manufacturing facility.

This two to four-hour course facilitates mastery of the key concepts required for successful printed circuit board troubleshooting and defect analysis.

This series of ten micro-modules introduce some of the key concepts required to optimize the design of printed circuit boards for manufacture. If you'd like to learn more after completing the series, consider consider taking the IPC Design for Manufacturability course.

This course provides a practical introduction to the terms, concepts, and acceptability criteria of the IPC-A-610 standard as they apply to the role of the operator.

This course provides a practical introduction to the terms, concepts, and acceptability requirements of the IPC J-STD-001 standard as they apply to the role of the operator.

In the competitive printed circuit board fabrication industry, high reliability and high yields are crucial for profitability. That's why process and manufacturing engineers involved in fabrication, assembly, and procurement need to have the necessary knowledge and skills to produce and evaluate top-quality printed circuit boards. This includes understanding materials, chemical processes, equipment parameters, and their impact on board quality. After completing this course, you will be able to: Identify and correct control processes that negatively affect circuit board quality Establish the root cause of potential defects to minimize and prevent loss of quality Recognize the interrelationships of PCB materials, processes, and equipment and how these relationships affect PCB and PCA quality Identify the root cause and corrective action for PCB defects, such as interconnect separation, delamination, wedge voids, plating folds, microvoids, surface pitting, and hole wall pull-away Identify the root cause and corrective action for electrodeposition defects, such as mouse bites, pitting, and domed or crown plating Identify the root cause and corrective action for solderability and assembly-related issues, such as outgassing, black pad, creep corrosion, and blow holes

Master the essentials of PCB Fabrication for Operators with a course that guides you step-by-step through each phase of the process. You’ll gain practical, in-depth knowledge about everything from inner-layer fabrication and lamination to solder mask application, surface finishes, and final testing

This course is ideal for operators, technicians, supervisory personnel and other staff members that must consistently and effectively employ the key tools, materials, and processes designed to keep workers safe within a manufacturing facility.

Learn how to create industry acceptable solder joints for through-hole and surface mount chip and gull wing components. This innovative multimedia course capitalizes on the power of the hear-see-do methodology to equip students with actionable techniques and best practices they can immediately apply on the job. Students will learn key concepts, tools, and techniques, then use the accompanying practice and project boards, available here, to practice and demonstrate their new skills.

Learn how to mitigate the health and safety risks associated with soldering. The course covers various topics, including the hazards related to soldering tools and materials, implementing effective safety measures, and maintaining a safe soldering environment.

Learn a specific set of knowledge and skills that every operator needs to build quality wires and cable harnesses all contained in as little as 16 hours of training.